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Taper/Detaper solution
Taper / Laminator
Ultra thin wafer can be processed with our special 'Zero Force" lamination technology which eliminates extra bow due to tape tension on wafers.
Our unique taping roller allows to process perfectly very high bumped wafers.
Lowest cost of ownership through our 'total gap control' software that fully adjust the gap between wafers which equal to lowest tape consumption.
Detaper / Peeler
Ultra thin wafer detaping with our special chuck, an anodized aluminium chuck that uses the 'Millefori' system. Fully adjustable software and mechanical detaping process. Wafer size option of 150mm,200mm and 300mm.
Taper for CDAF (Conductive Die Attached Film) process
Through many years of research and development, we are one of the pioneer in developing tools for CDaf process which is critical for the application requiring better thermal and electrical conductivity. We customize the configuration based on customer's needs and requirement. It is recipe-driven and for the wafer size of 6" -- 12" .
Ultra thin wafer can be processed with our special 'Zero Force" lamination technology which eliminates extra bow due to tape tension on wafers.
Our unique taping roller allows to process perfectly very high bumped wafers.
Lowest cost of ownership through our 'total gap control' software that fully adjust the gap between wafers which equal to lowest tape consumption.
Detaper / Peeler
Ultra thin wafer detaping with our special chuck, an anodized aluminium chuck that uses the 'Millefori' system. Fully adjustable software and mechanical detaping process. Wafer size option of 150mm,200mm and 300mm.
Taper for CDAF (Conductive Die Attached Film) process
Through many years of research and development, we are one of the pioneer in developing tools for CDaf process which is critical for the application requiring better thermal and electrical conductivity. We customize the configuration based on customer's needs and requirement. It is recipe-driven and for the wafer size of 6" -- 12" .