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Wafer Dry Film/Polymer Lamination
It is also known as dry photoresist lamination. The benefit of using dry film against using chemicals in the wet process is company could save a lot of costs in disposing the chemicals.
Laying Polymer layer on the wafer could be an important process in the TSV application. The vacuum process of the system could be very critical to put this polymer layer on the wafer.
Laying a layer of Conductive Die Attached Film (CDAF) would be critical for components which need a better electrical and thermal conductivity. As a pioneer in providing the tools for CDAF lamination, we work with customer for customization for this new process. For leadframe package designers and manufacturers, conductive die attach films provide much more design latitude and greater process control as compared to traditional die attach pastes. Film-based die attach materials have eliminated the fillet inherent with paste-based mediums and offer a lower die to paddle clearance.
Laying Polymer layer on the wafer could be an important process in the TSV application. The vacuum process of the system could be very critical to put this polymer layer on the wafer.
Laying a layer of Conductive Die Attached Film (CDAF) would be critical for components which need a better electrical and thermal conductivity. As a pioneer in providing the tools for CDAF lamination, we work with customer for customization for this new process. For leadframe package designers and manufacturers, conductive die attach films provide much more design latitude and greater process control as compared to traditional die attach pastes. Film-based die attach materials have eliminated the fillet inherent with paste-based mediums and offer a lower die to paddle clearance.