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Wafer Lithography system
Scanner of lithography process has been critcal in the IC Front End Manufacturing. Patented illumincations and resolution enhancemnet technologies has been used to meet the requirement of high resoluions in the 200mm to 300mm wafer volumn production line.
The family members of lithography system has been used in the IC back-end bumping process, eg Gold Bump, Solder Bump, Pillar Bump, WLCSP and RDL process. The high depth of focus (DOF) , high throughput and low cost of ownership (COO) solution have been helping our customers to compete in this highly competitive market. It also support wafer edge exposure and wafer edge protection.
Another family member of lithography system is designed for the TFT process of AM-OLED manufacturing up to 730mmx 920mm.
We provide Temperature Control Unit which is important to all wet processes in the Front-end/Bumping/AM-OLED. By controlling the temperature of its circulating mediator, it will exhange the heat of equipment's inner-environment and parts and guarantee the environment temperature requirements for the lithography process as well as other wet/dry processes.
The family members of lithography system has been used in the IC back-end bumping process, eg Gold Bump, Solder Bump, Pillar Bump, WLCSP and RDL process. The high depth of focus (DOF) , high throughput and low cost of ownership (COO) solution have been helping our customers to compete in this highly competitive market. It also support wafer edge exposure and wafer edge protection.
Another family member of lithography system is designed for the TFT process of AM-OLED manufacturing up to 730mmx 920mm.
We provide Temperature Control Unit which is important to all wet processes in the Front-end/Bumping/AM-OLED. By controlling the temperature of its circulating mediator, it will exhange the heat of equipment's inner-environment and parts and guarantee the environment temperature requirements for the lithography process as well as other wet/dry processes.